Functional multilayer anisotropic conductive adhesive film and method for preparing the same

ABSTRACT

A functional multilayer anisotropic conductive adhesive film, capable of bonding and package 0.18-0.13 micron IC chips and high density COF, includes a monomer layer, a reinforcing layer, a low-temperature, hot-melt resin layer, and a conductive particle layer, successively bonded by coating and drying processes. The monomer layer comprises a copolymer of butyl acrylate, methyl acrylate, glycol acrylate, and tetramethyl butyl peroxy-2-ethyl hexanoate. The reinforcing layer comprises long chain imidazole derivatives. The hot-melt resin layer comprises polymer of tocopheroxyl, novolac epoxy, acrylic rubbers and elastic mixture of acrylic rubbers and styrene-butadiene rubbers. The conductive particle layer comprises conductive particles and micro-encapsulating resin for receiving the conductive particles. Diameter of the conductive particles is selected from the group consisting of 3.00 μm±0.05, 3.25 μm±0.05, 3.50 μm±0.05, 3.75 μm±0.05 and 4.00 μm±0.05.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a copolymer resin, moreparticularly the present invention relates to an improved functionalmultilayer anisotropic conductive adhesive film (ACAF) and itspreparation method.

2. Background of the Invention

A need for reduced weight and thickness has recently arose in connectionwith electronic equipment and devices containing mounted IC chipsbecause of new developments related to such electronic equipment, andthere is also a need of functional connection stuffs for higher densityin boards for mounting such IC chips. For example, in order to set microfillets directly engaged with IC chips, flexibility of the connectionstuffs is necessary for higher density in boards for mounting such ICchips, thus anisotropic conductive film (ACF) is applied for thispurpose. For the moment, ACF market scale is over 20 billions, andplaying an important role in social development.

During research and development of the ACF, in a typical pencilanisotropic conductive film, fillet distance and fillet width is about100 microns. TAP and COG apply different adhesive resins, couplingagents, and silicon powder fillers, which is disclosed in Japan Patents,JP03129607, JP08325543, and JP0931419. Other conventional preparationmethod for ACF is disclosed in patents, such as CN99807810.7, U.S. Pat.No. 5,240,761, U.S. Pat. No. 4,113,981, U.S. Pat. No. 5,180,888, U.S.Pat. No. 5,240,761, and U.S. Pat. No. 4,737,112, which says that:defining a plurality of dimples on a resin film, placing conductiveballs in dimples and then carrying coating process, thereby formingfilms demanded.

During research and development of the ACF, in a typical pencilanisotropic conductive film, fillet distance and fillet width is about100 microns. TAP and COG apply different adhesive resins, couplingagents, and silicon powder fillers, which is disclosed in Japan Patents,JP03129607, JP08325543, and JP0931419. Other conventional preparationmethod for ACF is disclosed in patents, such as CN99807810.7, U.S. Pat.No. 5,240,761, U.S. Pat. No. 4,113,981, U.S. Pat. No. 5,180,888, U.S.Pat. No. 5,240,761, and U.S. Pat. No. 4,737,112, which says that:defines a plurality of dimples on a resin film, placing conductive ballsin dimples and then carrying coating process, thereby forming saidfilms.

Assembling component without punching and welding is the key to realizehigh density fillet deployment, high speed connection and ultrathinassembly goals. However, on condition that fillet width of IC chips tobe connected is about 100 microns, the conventional ACF can barely meetsuch connection needs. Therefore anisotropic conductive adhesive films(ACAF) play an important role in connection between IC chips or IC chipsbased on transparent substrates and high density FPC or COF. Researcheson ACAF synchronizing with development of IC chips focus on optimumpreparation processes and stuff preparation so as to improve connectionproperty and lower cost. Meanwhile development of ACAF will facilitateexpansion of LCD market.

a typical ACF can refer to multilayer or two layer ACF, adopting layerto layer affixing means which is disclosed in Japan application No.2001171033, it says first and second layers are tapes formed by coatingprocess with resins in different proportion. Furthermore, Japanapplication No. 2001178511 discloses that four coating processes arepresented, a typical ACF is formed with first multilayer anisotropicconductive adhesive layer, second insulating layer, third anisotropicconductive adhesive layer, and fourth insulating layer. However, ACFobtained from the conventional preparation means mentioned above canhardly meet chip connection needs on condition that chip fillet width is10 microns.

In light of the foregoing, there is a very desirable need to improve thetypical anisotropic conductive adhesive film.

SUMMARY OF THE INVENTION

In general, the systems and methods of the invention have severalfeatures, no single one of which is solely responsible for its desirableattributes. Without limiting the scope of the invention as expressed bythe claims which follow, its more prominent features will now bediscussed briefly. After considering this discussion, and particularlyafter reading the section entitled “Detailed Description of CertainEmbodiments” one will understand how the features of the system andmethods provide several advantages over traditional anisotropicconductive adhesive films.

In one aspect of the present invention, the objects of the presentinvention is to provide an improved functional multilayer anisotropicconductive adhesive film capable of connection and package under microfillet distance and fillet width conditions, such as 0.18 micron, thefunctional multilayer anisotropic conductive adhesive film of thepresent invention keeps stable insulation between micro electrodes about10 microns distance.

In order to achieve the object mentioned above, an improved functionalmultilayer anisotropic conductive adhesive film and correspondingpreparation method are disclosed. The anisotropic conductive adhesivefilm (ACAF) includes a monomer layer, a reinforcing layer, alow-temperature, hot-melt resin layer, and a conductive particle layer,wherein the monomer layer, the reinforcing layer, the resin layer andthe conductive particle layer are successive bonded by coating anddrying processes. The monomer layer comprises a copolymer of butylacrylate, methyl acrylate, glycol acrylate, and tetramethyl butylperoxy-2-ethyl hexanoate. The reinforcing layer comprises long chainimidazole derivatives. The low-temperature, hot-melt resin layercomprises polymer of tocopheroxyl, novolac epoxy, acrylic rubbers andelastic mixture of acrylic rubbers and styrene-butadiene rubbers. Theconductive particle layer comprises conductive particles andlow-temperature, hot-melt, micro-encapsulating resin for receiving theconductive particles, diameter of the conductive particles selected fromthe group consisting of 3.00 μm±0.05, 325 μm±0.05, 3.25 ρm±0.05, 3.75μm±0.05 and 4.00 μm±0.05.

In present invention, the conductive particles can be Michael Robert(brand) AV conductive particles.

in polymerization of the low-temperature, hot-melt resin layer, thetocopheroxyl is YP-70, 10-30 parts by weight. The novolac epoxy isselected from the group consisting of F-55, F-51 and F-44, 10-20 partsby weight. Bulk density of the acrylic rubbers is 0.480±0.1 g/cc,volatility<1.0%, Tg −30° C., solution viscosity under temperature of 25°C. is 5000-1000 mPa·S, 10-20 parts by weight. The styrene-butadienerubbers in the elastic mixture is SBR1502, Mooney viscosity of naturalrubber is ML100° C.(1+4)45-55, stretching stress 300%, mpa (35 minutes)14.1-18.6, tensile strength mpa (35 minutes)>23.7, elongation at break %(35 minutes)>415. The elastic mixture is 5-10 parts by weight. The longchain imidazole derivatives is a synthesis of 2,4-diamino-6-[-2-undecylimidazolyl (1)]-ethyl-cis-triazine, 1-cyanoethyl-2-undecyl-imidazoletrimellitate, and isocyanate derivative; 0.75-5 parts by weight.

content of the conductive particles is 30-40 parts by weight per 500parts by total weight of the anisotropic conductive adhesive film.

solvent in the present invention is obtained by mixing toluene and ethylacetate with a weight ratio of 4:6, and a solution is prepared with thereactant thereof by a weight concentration of 20%-40%.

monomer in the monomer layer is applied to adjust viscosity of surfacecoating layer on the anisotropic conductive adhesive film in accordancewith different IC chips, adjusting flexibility, rigidity, and preloadingcuring time. The copolymer in the monomer layer can be applied to otherresin solution in terms of composition or tolerance factor of themonomer. Due to small molecular weight distribution range, littleoligomer remains and little impurity remains characteristics of themonomer, by introducing functional matrix, together with isocyanate andepoxy ester, viscosity, intensity and waterlogging tolerance of the ACAFis improved, at the same time achieving anti foaming purpose. content ofthe monomer in the monomer layer is 5-10 parts by weight per 500 partsby the total weight of the anisotropic conductive adhesive film, whereinweight ratio of the butyl acrylate, the methyl acrylate, the glycolacrylates, and the tetramethyl butyl peroxy-2-ethyl hexanoate is set in7:3:2:1 according to requirement of corresponding chipset.

the long chain imidazole derivatives in the reinforcing layer isobtained by the following processes: mixing the2,4-diamino-6-[-2-undecyl imidazolyl (1)]-ethyl-cis-triazine, and1-cyanoethyl-2-undecyl-imidazole trimellitate with a weight ratio of1:1, keeping them reacting for 3 hours. Use 30 parts by weight reactantfrom the mixing process, and then heating the reactant from the mixingprocess up to 50° C., adding 0.8 part by weight toluene-2,4-diisocyanateand 60 parts by weight solvent into the reactant, and keeping themreacting for 5 hours. Because the long chain imidazole derivativescontains long carbon chain, its storage period is long and possessesfast curing characteristic under certain temperature and certain timeperiod by applying coating and micro encapsulation technique.

In the present invention, preparation of the elastic mixture to improveits thermal aging property is that: mixing and preparing the acrylicrubbers and the styrene-butadiene rubbers with weight ratio of 10:5, andthen physically admixing trace meta-alkaline reinforcing agentcontaining silica, silane coupling agent, and quaternary ammonium salt,in accordance with a weight ratio of 1:0.2:0.3. The acrylic rubbersfunction as an impact modifier to improve shock strength, high thermalstability, and weatherability. The elastic mixture facilitate the ACAFlowering elastic ratio, buffering stress, improving viscosity, andimproving interface effect of the conductive particles in the resinsolution, so as to optimize uniform distribution of the conductiveparticles.

The method for preparing functional multilayer anisotropic conductiveadhesive film of the present invention, adopting suspensionpolymerization means, comprises the following steps: according to theabove mentioned formula, mixing and stirring tocopheroxyl, novolacepoxy, and solvent in a reactor until the substances solved in thereactor; then adding and stirring acrylic rubbers and elastic mixture ofacrylic rubbers and styrene-butadiene rubbers into the reactant obtainedfrom previous step; and adding acrylic rubbers and solvent into theadmixture obtained from previous step, dissolving and stirring; in theend waiting as viscosity of the polymer naturally reduces to a degreethat no more polymerization occurs, thus a later use coating stuff forthe low-temperature, hot-melt resin layer is obtained.

According to the above mentioned formula, stir long chain imidazolederivatives by a counting stirring machine to form a later use coatingstuff for the reinforcing layer.

According to the above mentioned formula, mixing butyl acrylate, methylacrylate and glycol acrylate in a reactor, under presence of tetramethylbutyl peroxy-2-ethyl hexanoate, a copolymer is formed. After stirringand foam breaking, a later use coating stuff for the monomer layer isobtained.

Synthesis a later use coating stuff for the conductive particle layer,using conductive particles and low-temperature, hot-melt,micro-encapsulating resin for receiving the conductive particles. Inpresent invention, the conductive particles can be Michael Robert(brand) AV conductive particles.

Coating processes are carried out under temperature of 100° C.-135° C.to successively from the conductive particle layer, low-temperature,hot-melt resin layer, the reinforcing layer, and the monomer layer.After 8 minutes, the four layers are coated onto an opal surface-treatedpolyester film. Roll up the polyester film isolated by an isolatingfilm. After slice the polyester film and re-roll up the polyester film,the functional multilayer anisotropic conductive adhesive film of thepresent invention is obtained.

In the present invention, the stirring machine adopts 3D multi-DOFstirring apparatus possessed by the applicant (Patent application No.200310111757). The stirring machine can set capturing and positioningparameters to adjusting stirring process. The stirring machine can autodetect viscosity, and render hot-melt resin, elastic mixture resin,monomer mixture solution, and conductive particle paste uniformlydistributed, and forming a ropy layer on the surface of the ACAF, so asto prepare the anisotropic conductive adhesive film.

The anisotropic conductive adhesive film of the present invention can beapplied to connect LCD drive IC and high density FPC, downsizing andintegrating COF, TAB, COG IC chips, and capable of connecting IC filletswith 0.18 micron fillet distance or fillet width, which results in highproduction yield. The anisotropic conductive adhesive film of thepresent invention is a microelectronic bonding, packing, and functionalconnection technique, meeting preparation requirements of resin thermalcuring shrinkage, positioning/offset parameters, short circuit and ICdamage.

The multiple layered structure of the ACAF of the present invention canfacilitate bonding, packaging and connection between LCD,semiconductors, IC chips and FPC under 10 microns distance or width. Asa low temperature bonding stuff, the ACAF of the present invention islead free and environment protection, popular to be an assembly stuffadapting the environment and facilitating IC cards, high frequencydetectors, remote radio electronic labels to be functional andconvenient.

In connection between the ACAF of the present invention and fillets,resistance splicing sets up connection between protuberant electrodesand circuit, greatly reducing electrodes contact area, and providingsubstantial conductive particles to keep on-state status, meanwhileinsuring insulation between the electrodes. As far as connectioninvolving micro spaces, the ACAF is divided into connection layer,insulation layer and on-state layer, the anisotropic conductive isproportional to quantity of conductive particles at each of theprotuberant electrodes. The connection layer, insulation layer andon-state layer of the ACAF are respectively stratified and insulated oneanother, so the connection layer, insulation layer and on-state layerare respectively independent. Comparing to conventional ACF, the ACAF ofthe present invention has high conductive particle efficiency, highelectrode capturing efficiency, and low loss of conductive particlesbetween electrodes. Due to thermal expansion coefficient of the ACAFbetween IC chips and substrates, mechanical inner stress derivedtherefrom is buffered, at the same time improving viscosity thereof. TheACAF can be applied for multiple layered components with improvedsensitivity of the connection, punching free, Lead free, halogen free,and solder free.

BRIEF DESCRIPTION OF THE DRAWINGS

No drawing is presented.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS

While the subject invention will now be described in detail, it is doneso in connection with the illustrative embodiments. It is intended thatchanges and modifications can be made to the described embodimentswithout departing from the true scope and spirit of the subjectinvention as defined by the appended claims.

Basic formula for polymerization of the anisotropic conductive adhesivefilm of the present invention is listed as follow:

tocopheroxyl, YP-70, 10-30 parts by weight;

novolac epoxy, selected from the group consisting of F-55, F-51 andF-44, 10-20 parts by weight;

acrylic rubbers, 10-20 parts by weight;

elastic mixture, 5-10 parts by weight;

the long chain imidazole derivatives, 0.75-5 parts by weight;

monomer in the monomer layer, 5-10 parts by weight per 500 parts by thetotal weight of the anisotropic conductive adhesive film;

conductive particles, 30-40 parts by weight per 500 parts by totalweight of the anisotropic conductive adhesive film;

solvent, prepared by mixing toluene and ethyl acetate with a weightratio of 4:6, and a solution is prepared with the reactant thereof by aweight concentration of 20%-40%;

density of solution with conductive particles is 1.2 g/cm3;

the solution viscosity under temperature of 25° C. is 5000-10000 mPa·S.

Preferred Embodiment of the Present Invention

Processes for preparing functional multilayer anisotropic conductiveadhesive film of the present invention, includes the following steps:mix the tocopheroxyl, YP-70, 20 parts by weight, and the solvent, 200parts by weight in a reactor. Dissolve and stir in the reactor andadding novolac epoxy, 15 parts by weight. As the novolac epoxycompletely dissolves, add elastic mixture, 5 parts by weight andcontinuing stirring and dissolving. Add acrylic rubber, 20 parts byweight, and the solvent, 200 parts by weight, stirring and dissolving.Stand by for later use.

Put long chain imidazole derivative 3 parts by weight in a reactor, andstirring for 2 hours under temperature of 50° C. Set aside for lateruse.

Prepare 5 μm conductive particles, 30 part by weight, with reference tothe weight ratio of the anisotropic conductive adhesive film. A countingstirring apparatus stirs micro-encapsulating resin, and then combiningconductive particles. Set aside for later use.

Prepare monomer solution, 10 parts by weight. Weight ratio of thecopolymer is 10%. Set aside for later use.

All the stirring operations are carried out by a 3D multi-DOF stirringapparatus.

Then, coating processes are respectively carried out on an opalsurface-treated polyester film under temperature of 100° C.-130° C.-120°C. for 6-8 minutes. The four layers are coated onto the opalsurface-treated polyester film. Roll up the polyester film and slice thepolyester film. Re-roll up the polyester film with 0.03 mm-0.015 mmwidth, and 50 meters long per roll of the ACAF.

In terms of the anisotropic conductive adhesive film obtained accordingto the preferred embodiment, parameters of FOG series after slicing theACAF is listed as following:

Type: DBL SOFG200 Product: FOG

Thickness: 20 μm

Length: 50/100 m/roll

Width: 1.5 mm

Conductive particle material: particles surface gold plating

Density of conductive particles: 48 10 k/mm3

Minimum space capacity: 50 pitch

Conditions of preloading:

Temperature: 85° C.±5° C.

Pressure: 1.2 mpa

Time: 2 seconds

Loading condition:

Temperature: 187° C.

Pressure: 0.13 mPa

Time: 18 seconds

FOG outcome:

On-state resistance: 1.2Ω

Insulation resistance: 1012

Bonding intensity: 60N/m

Storage time: 7 months/−10-5° C.

Pass rate: 99%

Alternative Embodiment of the Present Invention

Processes for preparing functional multilayer anisotropic conductiveadhesive film of the present invention, includes the following steps:mix the tocopheroxyl, YP-70, 20 parts by weight, and the solvent, 200parts by weight in a reactor. Dissolve and stir in the reactor andadding novolac epoxy, 15 parts by weight. As the novolac epoxycompletely dissolves, add elastic mixture, 5 parts by weight andcontinuing stirring and dissolving. Add acrylic rubber, 20 parts byweight, and the solvent, 200 parts by weight, stirring and dissolving.Stand by for later use.

Put long chain imidazole derivative 3 parts by weight in a reactor, andstirring for 2 hours under temperature of 50° C. Set aside for lateruse.

Prepare 4 μm conductive particles, 30 part by weight, with reference tothe weight ratio of the anisotropic conductive adhesive film. Themicro-encapsulating resin is used for micro encapsulating the conductiveparticles. Set aside for later use.

Prepare monomer solution, 10 parts by weight. Weight ratio of thecopolymer is 20%. Set aside for later use.

All the stirring operations are carried out by a 3D multi-DOF stirringapparatus.

Then, coating processes are respectively carried out on an opalsurface-treated polyester film under temperature of 100° C.-130° C.-135°C. for 6-8 minutes. The four layers are coated onto the opalsurface-treated polyester film. Roll up the polyester film and slice thepolyester film. Re-roll up the polyester film with 0.03 mm-0.015 mmwidth, and 50 meters long per roll of the ACAF.

In terms of the anisotropic conductive adhesive film obtained accordingto the alternative embodiment, parameters of COF series after slicingthe ACAF is listed as following:

Type: DBL 40CT Product: COF

Thickness: 23 μm

Length: 50/100 m/roll

Width: 1.5-6 mm

Conductive particle size: 4 μm

Density of conductive particles: 130 10 k/mm3

Minimum space capacity: 30 pitch

Conditions of preloading:

Temperature: 85° C.±5° C.

Pressure: 1 mpa

Time: 5 seconds

Loading condition:

Temperature: 205° C.

Pressure: 50 mPa

Time: 16 seconds

COF outcome:

On-state resistance: >0.2Ω

Insulation resistance: 1012

Bonding intensity: 60N/m

Storage time: 6 months/−10-5° C.

Pass rate: 99%

Third Embodiment of the Present Invention

Processes for preparing functional multilayer anisotropic conductiveadhesive film of the present invention, includes the following steps:mix the tocopheroxyl, YP-70, 20 parts by weight, and the solvent, 200parts by weight in a reactor. Dissolve and stir in the reactor andadding novolac epoxy, 15 parts by weight. As the novolac epoxycompletely dissolves, add elastic mixture, 5 parts by weight andcontinuing stirring and dissolving. Add acrylic rubber, 20 parts byweight, and the solvent, 200 parts by weight, stirring and dissolving.Stand by for later use.

Put long chain imidazole derivative 3 parts by weight in a reactor, andstirring for 2 hours under temperature of 50° C. Set aside for lateruse.

Prepare 3 μm conductive particles, 30 part by weight, with reference tothe weight ratio of the anisotropic conductive adhesive film. Themicro-encapsulating resin is used for micro encapsulating the conductiveparticles. Set aside for later use.

Prepare monomer solution, 10 parts by weight. Weight ratio of thecopolymer is 30%. Set aside for later use.

All the stirring operations are carried out by a 3D multi-DOF stirringapparatus.

Then, coating processes are respectively carried out on an opalsurface-treated polyester film under temperature of 100° C.-130° C.—120°C. for 6-8 minutes. The four layers are coated onto the opalsurface-treated polyester film. Roll up the polyester film and slice thepolyester film. Re-roll up the polyester film with 0.03 mm-0.015 mmwidth, and 50 meters long per roll of the ACAF.

In terms of the anisotropic conductive adhesive film obtained accordingto the third embodiment, parameters of COG series after slicing the ACAFis listed as following:

Type: DBL-30CG Product: COG

Thickness: 30 μm

Length: 50/100 m/roll

Width; 1.5 mm

Conductive particle size: 3 μm

Density of conductive particles: 180 10 k/mm3

Minimum space capacity: 15 μm-20 μm

Conditions of preloading:

Temperature: 85° C.±5° C.

Pressure: 1 mpa

Time: 3 seconds

Loading condition:

Temperature: 210° C.

Pressure: 60 mPa

Time: 19 seconds

COG outcome:

On-state resistance: >0.1Ω

Insulation resistance: 1012

Bonding intensity: 60N/m

Storage time: 5 months/−10-5° C.

Pass rate: 99%

First Comparison Embodiment of the Present Invention

Processes for preparing functional multilayer anisotropic conductiveadhesive film, includes the following steps: mix the tocopheroxyl,YP-70, 20 parts by weight, and the solvent, 200 parts by weight in areactor. Dissolve and stir in the reactor and adding novolac epoxy, 15parts by weight. Add acrylic rubber, 20 parts by weight, and thesolvent, 200 parts by weight, stirring and dissolving. Stand by forlater use.

Put long chain imidazole derivative 3 parts by weight in a reactor, andstirring for 2 hours under temperature of 50° C. Set aside for lateruse.

Prepare 5 μm conductive particles, 30 part by weight, with reference tothe weight ratio of the anisotropic conductive adhesive film. Themicro-encapsulating resin is used for micro encapsulating the conductiveparticles. Set aside for later use.

Prepare monomer solution, 10 parts by weight. Weight ratio of thecopolymer is 10%. Set aside for later use.

All the stirring operations are carried out by a 3D multi-DOF stirringapparatus.

Then, coating processes are respectively carried out on an opalsurface-treated polyester film under temperature of 100° C.-130° C.-120°C. for 6-8 minutes. The four layers are coated onto the opalsurface-treated polyester film. Roll up the polyester film and slice thepolyester film. Re-roll up the polyester film with 0.03 mm-0.015 mmwidth, and 50 meters long per roll of the ACAF.

In the first comparison embodiment, the styrene-butadiene rubber isexcluded, and the monomer solution is adjusted. In terms of theanisotropic conductive adhesive film obtained according to the firstcomparison embodiment, parameters of FOG series after slicing the ACAFis listed as following:

Type: DBL SOFG200 Product: FOG

Thickness: 20 μm

Length: 50/100 m/roll

Width: 1.5 mm

Conductive particle material: conductive gold

Density of conductive particles: 48 10 k/mm3

Minimum space capacity: 50 pitch

Conditions of preloading:

Temperature: 85° C.±5° C.

Pressure; 1.2 mpa

Time: 2 seconds

Loading condition:

Temperature: 187° C.

Pressure: 0.13 mPa

Time: 18 seconds

FOG outcome:

On-state resistance: 1.0Ω

Insulation resistance: 1011

Bonding intensity: 30N/m

Storage time: 5 months/−10-5° C.

Pass rate: 30%

Second Comparison Embodiment of the Present Invention

Processes for preparing functional multilayer anisotropic conductiveadhesive film, includes the following steps: mix the tocopheroxyl,YP-70, 20 parts by weight, and the solvent, 200 parts by weight in areactor. Dissolve and stir in the reactor and adding novolac epoxy, 15parts by weight. As the novolac epoxy completely dissolves, add elasticmixture, 5 parts by weight and continuing stirring and dissolving. Addacrylic rubber, 20 parts by weight, and the solvent, 200 parts byweight, stirring and dissolving. Stand by for later use.

Put long chain imidazole derivative 3 parts by weight in a reactor, andstirring for 2 hours under temperature of 50° C. Set aside for lateruse.

Prepare 4 μm conductive particles, 30 part by weight, with reference tothe weight ratio of the anisotropic conductive adhesive film. Themicro-encapsulating resin is used for micro encapsulating the conductiveparticles. Set aside for later use.

All the stirring operations are carried out by a 3D multi-DOF stirringapparatus.

Then, coating processes are respectively carried out on an opalsurface-treated polyester film under temperature of 100° C.-130° C.-120°C. for 6-8 minutes. The four layers are coated onto the opalsurface-treated polyester film. Roll up the polyester film and slice thepolyester film. Re-roll up the polyester film with 0.03 mm-0.015 mmwidth, and 50 meters long per roll of the ACAF.

In the second comparison embodiment, the monomer solution is excluded.In terms of the anisotropic conductive adhesive film obtained accordingto the Second comparison embodiment, parameters of COF series afterslicing the ACAF is listed as following:

Type: DBL-40CT Product: COF

Thickness: 23 μm

Length: 50/100 m/roll

Width: 1.5-6 mm

Conductive particle size: 4 μm

Density of conductive particles: 130 10 k/mm3

Minimum space capacity: 30 pitch

Conditions of preloading:

Temperature: 85° C.±5° C.

Pressure: 1 mpa

Time: 5 seconds

Loading condition:

Temperature; 205° C.

Pressure: 1 mPa

Time: 5 seconds

COF out come:

On-state resistance: >0.7Ω

Insulation resistance: 108

Bonding intensity: 40N/m

Storage time: 5 months/−10-5° C.

Pass rate: 90%

Third Comparison Embodiment of the Present Invention

Processes for preparing functional multilayer anisotropic conductiveadhesive film, includes the following steps: mix the tocopheroxyl,YP-70, 20 parts by weight, and the solvent, 200 parts by weight in areactor. Dissolve and stir in the reactor and adding novolac epoxy, 15parts by weight. As the novolac epoxy completely dissolves, add elasticmixture, 5 parts by weight and continuing stirring and dissolving. Addthe solvent, 200 parts by weight, stirring and dissolving. Stand by forlater use.

Put long chain imidazole derivative 3 parts by weight in a reactor, andstirring for 2 hours under temperature of 50° C. Set aside for lateruse.

Prepare 3 μm conductive particles, 30 part by weight, with reference tothe weight ratio of the anisotropic conductive adhesive film. Themicro-encapsulating resin is used for micro encapsulating the conductiveparticles. Set aside for later use.

Prepare monomer solution, 10 parts by weight. Weight ratio of thecopolymer is 30%. Set aside for later use.

All the stirring operations are carried out by a 3D multi-DOF stirringapparatus.

Then, coating processes are respectively carried out on an opalsurface-treated polyester film under temperature of 100° C.-130° C.-120°C. for 6-8 minutes. The four layers are coated onto the opalsurface-treated polyester film. Roll up the polyester film and slice thepolyester film. Re-roll up the polyester film with 0.03 mm-0.015 mmwidth, and 50 meters long per roll of the ACAF.

In the third comparison embodiment, the acrylic rubber is excluded. Interms of the anisotropic conductive adhesive film obtained according tothe third comparison embodiment, parameters of COG series after slicingthe ACAF is listed as following:

Type: DBL-30CG Product: COG

Thickness: 30 μm

Length: 50/100 m/roll

Width: 1.5 mm

Conductive particle size: 3 μm

Density of conductive particles: 180 10 k/mm3

Minimum space capacity: 15 μm-20 μm

Conditions of preloading:

Temperature: 85° C.±5° C.

Pressure: 1 mpa

Time: 3 seconds

Loading condition:

Temperature: 210° C.

Pressure: 60 mPa

Time: 19 seconds

COG outcome:

On-state resistance: >0.1Ω

Insulation resistance: 1011

Bonding intensity: 10N/m

Storage time: 7 days/−10-5° C.

Pass rate: 0

Having thus described particular embodiments of the invention, variousalterations, modifications, and improvements will readily occur to thoseskilled in the art. Such alterations, modifications and improvements asare made obvious by this disclosure are intended to be part of thisdescription though not expressly stated herein, and are intended to bewithin the spirit and scope of the invention. Accordingly, the foregoingdescription is by way of example only, and not limiting. The inventionis limited only as defined in the following claims and equivalentsthereto.

1. A functional multilayer anisotropic conductive adhesive film comprising: a monomer layer, comprising a copolymer of butyl acrylate, methyl acrylate, glycol acrylate, and tetramethyl butyl peroxy-2-ethyl hexanoate; a reinforcing layer, comprising long chain imidazole derivatives; a low-temperature, hot-melt resin layer, comprising polymer of tocopheroxyl, novolac epoxy, acrylic rubbers and elastic mixture of acrylic rubbers and styrene-butadiene rubbers; and a conductive particle layer, comprising conductive particles and low-temperature, hot-melt, micro-encapsulating resin for receiving the conductive particles, diameter of the conductive particles selected from the group consisting of 3.00 μm±0.05, 3.25 μm±0.05, 3.50 μm±0.05, 3.75 μm±0.05 and 4.00 μm±0.05; wherein the monomer layer, the reinforcing layer, the resin layer and the conductive particle layer are successively bonded by coating and drying processes.
 2. The functional multilayer anisotropic conductive adhesive film as in claim 1, wherein in polymerization of the resin layer, the tocopheroxyl is YP-70, and is present in an amount of 10-30 parts by weight; the novolac epoxy is selected from the group consisting of F-55, F-51 and F-44, and is present in an amount of 10-20 parts by weight; bulk density of the acrylic rubbers is 0.48±0.1 g/cc, volatility<1.0%, Tg −30° C., and the acrylic rubbers are present in an amount of 10-20 parts by weight; the styrene-butadiene rubbers in the elastic mixture is SBR1502, the elastic mixture is present in an amount of 5-10 parts by weight; and the long chain imidazole derivatives in the reinforcing layer are a synthesis of 2,4-diamino-6-[-2-undecyl imidazolyl(1)]-ethyl-cis-triazine, 1-cyanoethyl-2-undecyl-imidazole trimellitate, and isocyanate derivative, and are present in an amount of 0.75-5 parts by weight.
 3. The functional multilayer anisotropic conductive adhesive film as in claim 1, wherein content of the conductive particles is 30-40 parts by weight per 500 parts by total weight of the anisotropic conductive adhesive film.
 4. The functional multilayer anisotropic conductive adhesive film as in claim 1, wherein content of the conductive particles is 5-10 parts by weight per 500 parts by the total weight of the anisotropic conductive adhesive film, and wherein weight ratio of the butyl acrylate, the methyl acrylate, the glycol acrylates, and the tetramethyl butyl peroxy-2-ethyl hexonate is set in 7:3:2:1 according to requirement of corresponding chipset.
 5. A preparation method of functional multilayer anisotropic conductive adhesive film, adopting suspension polymerization means, comprising the following steps: A, mixing and stirring tocopheroxyl, novolac epoxy, and solvent; B, adding acrylic rubbers and elastic mixture of acrylic rubbers and styrene-butadiene rubbers into the admixture obtained from step A, stirring; C, adding acrylic rubbers and solvent into the admixture obtained from step B, dissolving and stirring; D, waiting as viscosity of the polymer obtained from step C naturally reduces to a degree that no more polymerization occurs, a later use coating stuff for a low-temperature, hot-melt resin layer obtained; E, stirring long chain imidazole derivatives to form a later use coating stuff for a reinforcing layer; F, a stirring apparatus stirring micro-encapsulating resin, and then combining conductive particles in a conductive particle layer; G, mixing butyl acrylate, methyl acrylate and glycol acrylate, under presence of tetramethyl butyl peroxy-2-ethyl hexanoate, a copolymer formed, after stirring and foam breaking, a later use coating stuff for a monomer layer obtained; H, coating process carried out under temperature of 100° C.-135° C. to successively form the conductive particle layer, low-temperature, hot-melt resin layer, the reinforcing layer, and the monomer layer, thereby the functional multilayer anisotropic conductive adhesive film of the present invention obtained.
 6. The preparation method of functional multilayer anisotropic conductive adhesive film as in claim 5, wherein, the tocopheroxyl is YP-70, and is present in an amount of 10-30 parts by weight; the novolac epoxy is selected from the group consisting of F-51 and F-44, and is present in an amount of 10-20 parts by weight; bulk density of the acrylic rubbers is 0.48±0.1 g/cc, volatility<1.0%, Tg −30° C., solution viscosity under temperature of 25° C. is 5000-10000 mPa·S, and the acrylic rubbers are present in an amount of 10-20 parts by weight; the styrene-butadiene rubbers in the elastic mixture are SBR1502, Mooney viscosity of natural rubber is ML100° C. (1+4)45-55, stretching stress 300%, mpa (35 minutes) 14.1-18.6, tensile strength mpa (35 minutes)>23.7, elongation at break % (35 minutes)>415; the elastic mixture is present in an amount of 5-10 parts by weight; the long chain imidazole derivatives are a synthesis of 2,4-diamino-6-[-2-undecyl imidazolyl (1)]-ethyl-cis-triazine, 1-cyanoethyl-2-undecyl-imidazole trimellitate, and isocyanate derivative; and are present in an amount of 0.75-5 parts by weight; diameter of the conductive particles is selected from the group consisting of 3.00 μm±0.05, 3.25 μm±0.05, 3.50 μm±0.05, 3.75 μm±0.05 and 4.00 μm±0.05, content of the conductive particles is 30-40 parts by weight per 500 parts by total weight of the anisotropic conductive adhesive film; content of monomer in the monomer layer is 5-10 parts by weight per 500 parts by the total weight of the anisotropic conductive adhesive film, wherein weight ratio of the butyl acrylate, the methyl acrylate, the glycol acrylates, and the tetramethyl butyl peroxy-2-ethyl hexanoate is set in 7:3:2:1 according to requirement of corresponding chipset.
 7. The preparation method of functional multilayer anisotropic conductive adhesive film as in claim 5, wherein the long chain imidazole derivatives in the reinforcing layer is obtained by the following processes: mixing the 2,4-diamino-6-[-2-undecyl imidazolyl(1)]-ethyl-cis-triazine, and 1-cyanoethyl-2-undecyl-imidazole trimellitate with a weight ratio of 1:1, keeping them reacting for 3 hours, and then heating reactant from the mixing process up to 50° C., adding toluene-2,4-diisocyanate and solvent into the reactant from mixing process with a weight ratio of 0.8:60:30, and keeping reacting for 5 hours.
 8. The preparation method of functional multilayer anisotropic conductive adhesive film as in claim 5, wherein preparation of the elastic mixture to improve its thermal aging property is that: mixing and preparing the acrylic rubbers and the styrene-butadiene rubbers with weight ratio of 10:5, and then physically admixing trace meta-alkaline reinforcing agent containing silica, silane coupling agent, and quaternary ammonium salt, in accordance with a weight ratio of 1:0.2:0.3.
 9. The preparation method of functional multilayer anisotropic conductive adhesive film as in claim 5, wherein the solvent is obtained by mixing toluene and ethyl acetate with a weight ratio of 4:6, and a solution is prepared with the reactant thereof by a weight concentration of 20%-40%.
 10. The functional multilayer anisotropic conductive adhesive film as in claim 2, wherein content of the conductive particles is 30-40 parts by weight per 500 parts by total weight of the anisotropic conductive adhesive film.
 11. The functional multilayer anisotropic conductive adhesive film as in claim 2, wherein content of the conductive particles is 5-10 parts by weight per 500 parts by the total weight of the anisotropic conductive adhesive film, and wherein weight ratio of the butyl acrylate, the methyl acrylate, the glycol acrylates, and the tetramethyl butyl peroxy-2-ethyl hexonate is set in 7:3:2:1 according to requirement of corresponding chipset.
 12. The preparation method of functional multilayer anisotropic conductive adhesive film as in claim 6, wherein the long chain imidazole derivatives in the reinforcing layer is obtained by the following processes: mixing the 2,4-diamino-6-[-2-undecyl imidazolyl(1)]-ethyl-cis-triazine, and 1-cyanoethyl-2-undecyl-imidazole trimellitate with a weight ratio of 1:1, keeping them reacting for 3 hours, and then heating reactant from the mixing process up to 50° C., adding toluene-2,4-diisocyanate and solvent into the reactant from mixing process with a weight ratio of 0.8:60:30, and keeping reacting for 5 hours.
 13. The preparation method of functional multilayer anisotropic conductive adhesive film as in claim 6, wherein preparation of the elastic mixture to improve its thermal aging property is that: mixing and preparing the acrylic rubbers and the styrene-butadiene rubbers with weight ratio of 10:5, and then physically admixing trace meta-alkaline reinforcing agent containing silica, silane coupling agent, and quaternary ammonium salt, in accordance with a weight ratio of 1:0.2:0.3.
 14. The preparation method of functional multilayer anisotropic conductive adhesive film as in claim 6, wherein the solvent is obtained by mixing toluene and ethyl acetate with a weight ratio of 4:6, and a solution is prepared with the reactant thereof by a weight concentration of 20%-40%. 